This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the c

Design technology to address the new and vast problem of heterogeneous embedded systems design while remaining compatible with standard “More Moore” flows,

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate