We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in cir

Presents the background on 3D integration technology, and shows the major benefits offered by 3D integration. EDA design tools and methodologies for 3D ICs are

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimension