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From the reviews: "This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond p
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Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas�
Materials for Advanced Packaging
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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have
Copper Wire Bonding
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This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.
Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)
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Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliabilit