Process Modeling of Chemical Mechanical Polishing (CMP) Based Upon the Relationship Between Preston's Coefficient and Friction Coefficient

Process Modeling of Chemical Mechanical Polishing (CMP) Based Upon the Relationship Between Preston's Coefficient and Friction Coefficient
Author :
Publisher :
Total Pages : 60
Release :
ISBN-10 : OCLC:46399920
ISBN-13 :
Rating : 4/5 ( Downloads)

Book Synopsis Process Modeling of Chemical Mechanical Polishing (CMP) Based Upon the Relationship Between Preston's Coefficient and Friction Coefficient by : Yongsik Moon

Download or read book Process Modeling of Chemical Mechanical Polishing (CMP) Based Upon the Relationship Between Preston's Coefficient and Friction Coefficient written by Yongsik Moon and published by . This book was released on 1997 with total page 60 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Process Modeling of Chemical Mechanical Polishing (CMP) Based Upon the Relationship Between Preston's Coefficient and Friction Coefficient Related Books

Process Modeling of Chemical Mechanical Polishing (CMP) Based Upon the Relationship Between Preston's Coefficient and Friction Coefficient
Language: en
Pages: 60
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
Language: en
Pages: 327
Authors: Jianfeng Luo
Categories: Science
Type: BOOK - Published: 2013-03-09 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semicon
Advances in Chemical Mechanical Planarization (CMP)
Language: en
Pages: 538
Authors: Babu Suryadevara
Categories: Technology & Engineering
Type: BOOK - Published: 2016-01-09 - Publisher: Woodhead Publishing

DOWNLOAD EBOOK

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semicon
Modeling of Chemical Mechanical Polishing at Multiple Scales
Language: en
Pages: 258
Authors: Guanghui Fu
Categories:
Type: BOOK - Published: 2002 - Publisher:

DOWNLOAD EBOOK

Chemical Mechanical Polishing (CMP) has grown rapidly during the past decade as part of mainstream processing method in submicron integrated circuit manufacturi
Mechanical Aspects of the Material Removal Mechanism in Chemical Mechanical Polishing (CMP)
Language: en
Pages: 436
Authors: Yongsik Moon
Categories:
Type: BOOK - Published: 1999 - Publisher:

DOWNLOAD EBOOK