Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging

Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging
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Publisher : CRC Press
Total Pages : 0
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ISBN-10 : 1138033561
ISBN-13 : 9781138033566
Rating : 4/5 (566 Downloads)
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Book Synopsis Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging by : Xing-Chang Wei

Download or read book Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: 7.2.2.1 Modeling of the Graphene Absorber -- 7.2.2.2 Fabrication and Measurement -- 7.2.2.3 Conclusion -- References -- Index


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